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this is information on a product in full production. june 2014 docid025890 rev 1 1/12 ESDAULC5-1BF4 low clamping and ultra low capacitance single line bidirectional esd protection datasheet - production data features ? low clamping voltage ? bidirectional device ? dynamic resistance rd = 0.3 ? typ. ? low leakage current ? 0201 package size compatible ? ultra small pcb area: 0.18 mm 2 ? ecopack ? 2 compliant component complies with the following standards ? iec 61000-4-2 level 4: ? 30 kv (air discharge) ? 30 kv (contact discharge) applications where transient over voltage protection in esd sensitive equipment is required, such as: ? smartphones, mobile phones and accessories ? tablet, pc, netbooks and notebooks ? portable multimedia devices and accessories ? digital cameras and camcorders ? communication and highly integrated systems description the ESDAULC5-1BF4 is a bidirectional single line tvs diode designed to protect the data line or other i/o ports against esd transients. the device is ideal for applications where both reduced line capacitance and board space saving are required. figure 1. functional diagram 0201 package www.st.com
characteristics ESDAULC5-1BF4 2/12 docid025890 rev 1 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings symbol parameter value unit v pp (1) peak pulse voltage iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 30 30 kv p pp (1) peak pulse power (8/20 s) 140 w i pp (1) peak pulse current (8/20 s) 10 a t j operating junction temperature range -40 to 150 c t stg storage temperature range -65 to +150 c t l maximum lead temperature for soldering during 10 s 260 c 1. for a surge greater than the maximum values, the diode will fail in short-circuit. symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = peak pulse current r br rm rm rm pp v = clamping voltage cl d = dynamic resistance t = voltage temperature c = line capacitance line v v i pp slope: 1/r d cl cl table 2. electrical characteristics (values, t amb = 25 c) symbol test conditions value unit min. typ. max. v br i r = 1 ma 5.8 8.5 v i rm v rm = 3 v 70 na v cl 8 kv contact discharge after 30 ns, iec 61000-4-2 13.5 v c line v line = 0 v, f = 1 mhz, v osc = 30 mv 1.5 3 pf r d dynamic resistance, pulse duration 100 ns, i/o to gnd 0.3 ?
docid025890 rev 1 3/12 ESDAULC5-1BF4 characteristics 12 figure 3. leakage current versus junction temperature (typical values) figure 4. s21 attenuation measurement result i r ( na) 1 10 100 1000 25 50 75 100 125 150 v = v = 3 v rrm direct and reverse t j c () 100.0k 1.0m 10.0m 100.0m 1.0g -4.00 -3.00 -2.00 -1.00 0.00 s21 s21 (db) f(hz) figure 5. eye diagram hdmi 1.4 (1080p/60 hz) 3.35 gbps thru pcb figure 6. eye diagram hdmi 1.4 (1080p/60 hz) 3.35 gbps ESDAULC5-1BF4 rise time:94.1 ps fall time: 94.1 ps eye height: 804 mv eye width: 275.8 ps 250 mv/c 49.8 ps/c rise time: 131.7 ps fall time: 130.6 ps eye height: 745 mv eye width: 270.7 ps 250 mv/c 49.8 ps/c figure 7. eye diagram display port hbr 2.7 gbps thru pcb figure 8. eye diagram display port hbr 2.7 gbps ESDAULC5-1BF4 rise time: 94.6 ps fall time: 94.6 ps eye height: 923 mv eye width: 356.4 ps 250 mv/c 61.7 ps/c rise time: 131.6 ps fall time: 131.6 ps eye height: 356.4 mv eye width: 294.7 ps 250 mv/c 61.7 ps/c
characteristics ESDAULC5-1BF4 4/12 docid025890 rev 1 figure 9. eye diagram mhl 1.0 2.5 gbps thru pcb figure 10. eye diagram mhl 1.0 2.5gbpsESDAULC5-1BF4 rise time: 92.2 ps fall time: 90.6 ps 200 mv/c 74.1 ps/c eye height: 743 mv eye width: 430.1 ps 200 mv/c 74.1 ps/c rise time: 136.7 ps fall time: 133.4 ps eye height: 729 mv eye width: 418.6 ps figure 11. eye diagram sd4.2, 3.12 gbps thru pcb figure 12. eye diagram sd4.2, 3.12 gbps ESDAULC5-1BF4 rise time: 98.5 ps fall time: 96.1 ps eye height: 345 mv eye width: 299.5 ps 140 mv/c 53.4 ps/c rise time: 137.7 ps fall time: 138.8 ps eye height: 321 mv eye width: 294.7 ps 140 mv/c 53.4 ps/c figure 13. eye diagram usb2.0, 480 mbps thru pcb figure 14. eye diagram usb2.0, 480 mbps ESDAULC5-1BF4 rise time: 532 ps fall time: 532 ps 200 mv/c 347.2 ps/c rise time: 532 ps fall time: 532 ps eye height: 718 mv eye width: 2042 ps 200 mv/c 347.2 ps/c rise time: 556 ps fall time: 548 ps eye height: 716 mv eye width: 2048 ps
docid025890 rev 1 5/12 ESDAULC5-1BF4 characteristics 12 figure 17. tlp measurements figure 15. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 16. esd response to iec 61000-4-2 (-8 kv contact discharge) 20 v/div 7.5 v 4 20 ns/div v : peak clamping voltage cl v :clamping voltage at 30 ns cl v :clamping voltage at 60 ns cl v :clamping voltage at 100 ns cl 1 2 3 4 1 11.3 v 2 13.3 v 3 2 106.8 v -8 v 4 20 ns/div 20 v/div -10 3 2 -12.4 v 1 -113.1 v v : peak clamping voltage cl v :clamping voltage at 30 ns cl v :clamping voltage at 60 ns cl v :clamping voltage at 100 ns cl 1 2 3 4 i (a) pp 0 2 4 6 8 10 12 14 16 18 20 5 6 7 8 9 1011121314151617181920 v (v) cl t j = 25 c
package information ESDAULC5-1BF4 6/12 docid025890 rev 1 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 18. 0201 package dimension definitions table 3. 0201 package dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.28 0.3 0.32 0.0110 0.0118 0.0126 b 0.125 0.14 0.155 0.0049 0.0055 0.0061 d 0.57 0.6 0.63 0.0224 0.0236 0.0248 d1 0.35 0.0138 e 0.27 0.3 0.33 0.0106 0.0118 0.0130 e1 0.175 0.19 0.205 0.0069 0.0075 0.0081 fd 0.065 0.08 0.095 0.0026 0.0031 0.0037 fe 0.11 0.125 0.13 0.0043 0.0049 0.0051 to p bottom side d e a fd fe b d1 e1
docid025890 rev 1 7/12 ESDAULC5-1BF4 package information 12 note: the marking codes can be rotated by 90 or 180 to differentiate assembly location.in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. figure 21. tape and reel specification figure 19. footprint in mm (inches) figure 20. marking 0.243 (0.0096) 0.170 (0.0067) 0.300 (0.0118) 0.243 (0.0096) 0.656 (0.0258) pin1 pin2 l bar indicates pin 1 user direction of unreeling all dimensions in mm 4.0 0.1 2.0 0.05 8.0 + 0.03 - 0.01 2.0 0.05 1.75 0.1 3.5 0.05 ? 1.5 0.1 0.36 0.03 0.38 0.03 0.22 0.68 0.03 5 5 5 5 5 5 5
recommendation on pcb assembly ESDAULC5-1BF4 8/12 docid025890 rev 1 3 recommendation on pcb assembly 3.1 stencil opening design 1. general recommendations on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 22. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. recommended stencil window a) stencil opening thickness: 80 m b) other dimensions: see figure 23 figure 23. recommended stencil window position, stencil opening thickness: 80 m l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = 0.230 (0.0091) 0.183 (0.0072) 0.170 (0.0067) 0.300 (0.0118) 0.285 (0.0112) 0.656 (0.0258) 0.643 (0.0253) footprint stencil window 0.007 (0.00027) 0.007 (0.00027) 0.008 (0.0003) 0.008 (0.0003) mm (inches) 0.243 (0.0096)
docid025890 rev 1 9/12 ESDAULC5-1BF4 recommendation on pcb assembly 12 3.2 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. use solder paste with fine particles: type 4 (powder particle size 20-48 m per ipc j std-005). 3.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 1.0 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 3.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
recommendation on pcb assembly ESDAULC5-1BF4 10/12 docid025890 rev 1 3.5 reflow profile figure 24. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
docid025890 rev 1 11/12 ESDAULC5-1BF4 ordering information 12 4 ordering information figure 25. ordering information scheme 5 revision history table 4. ordering information order code marking package weight base qty delivery mode ESDAULC5-1BF4 l (1) 1. the marking codes can be rotated by 90 or 180 to differentiate assembly location 0201 0.116 mg 15000 tape and reel esda - 1 b ulc 5 f4 esda array ultra low capacitance breakdown voltage 5 = 5.8 v min number of lines directional b = bi-directional package = f4 0201 table 5. document revision history date revision changes 03-jun-2014 1 first issue.
ESDAULC5-1BF4 12/12 docid025890 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com

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